Mirrored Memory Module

60-Key  Expansion  Console,  B.3,  I.8,  I.9 60-Key  Second Expansion  Console,  B.3,  I.8,  I.9 Analog ports,  I.7 Battery.  See  Cautions Cabinets Expansion, F.2 Cautions, E.1 Battery, E.1 Fuse,  E.1 Power supply,  E.1 CO  lines Capacities.  See  System  capacities Connecting, I.5 Console,  B.3,  I.8, I.9 ESI  Cordless  Handsets.  See  Phones ESI  Presence Management,  D.1 Expansion Cabinet,  F.2 Expansion Console,  B.3,  I.8, I.9 Fuse.  See  Cautions Grounding, F.2,  I.1,  I.3 Hardware  installation,  E.2–F.15 LED functions,  F.15, G.6,  H.6 Main  board,  A.2 Memory  Module, A.3 Installation  or  replacement,  F.5–F.8,  G.5,  H.5 Mirrored Memory  Module  (M3), A.3 Installation, F.9–F.13 MOH,  I.3 NSP  (Network  Services  Processor),  A.7 Overlays,  B.4 Paging, I.4 Phones Digital  Feature  Phones,  B.1 ESI  Cordless  Handsets,  B.2,  B.3 IP  Phones,  B.2 VIP  Softphone,  B.4 Port  cards Capacities, A.4 Charts, I.13–I.20 Installation, G.3–G.4,  G.3–G.4 Installation, F.2 Port  card  adapter,  F.3 Power,  I.1 Power  Distribution Shelf,  A.3 Power supply.  See  Cautions Transformers, wall-mount,  A.3 PRI, I.5 Regulatory  information  (U.S. and Canada),  E.2 Ringer  equivalence number  (REN),  E.2 Serial  ports,  I.3 Site location,  F.1 SMDR, I.3 System  capacities,  D.1 T1, I.5 UPS (uninterruptible  power  supply),  I.1 VIP  Softphone.